Sökning: "Karl Wennergren"

Hittade 1 uppsats innehållade orden Karl Wennergren.

  1. 1. Metal Filling of Through Silicon Vias (TSVs) using Wire Bonding Technology

    Uppsats för yrkesexamina på avancerad nivå, KTH/Mikro- och nanosystemteknik

    Författare :Karl Fredrik Wennergren; [2014]
    Nyckelord :Through Silicon Vias; TSV; wire bonding;

    Sammanfattning : Through Silicon Vias (TSVs) are vertical interconnections providing the shortest possible signal paths between vertically stacked chips in 3D packaging. In this thesis, TSVs are fabricated and two novel approaches for the metal filling of TSVs are investigated. A wire bonder is utilized to apply TSV core material in the form of gold stud bumps. LÄS MER