Sökning: "Through-silicon via"
Hittade 2 uppsatser innehållade orden Through-silicon via.
1. Optimization of through-silicon via structures in a fingerprint sensor package
Master-uppsats, Lunds universitet/Avdelningen för Biomedicinsk teknikSammanfattning : The through-silicon via (TSV) is a type of vertical electrical connection that can pass through a silicon wafer or die. By using TSVs, compared to using wire bonding as interconnections in a capacitive fingerprint sensor, the capacitive strength between the sensor die and the finger can be increased. LÄS MER
2. Development of Through Glass Vias (TGVs) for Interposer Applications
Master-uppsats, KTH/Mikro- och nanosystemteknikSammanfattning : In this thesis work the manufacturing of through glass vias (TGVs) is presented. The TGVs were manufactured by adapting technique based on magnetic assembly developed at KTH for creating through silicon vias (TSVs). LÄS MER