Sökning: "Flip-chip"
Hittade 4 uppsatser innehållade ordet Flip-chip.
1. Characterization of Graphene-Based Anisotropic Conducting Adhesives : A study regarding x-ray sensing applications
Master-uppsats, KTH/Skolan för elektroteknik och datavetenskap (EECS)Sammanfattning : A common method of cancer treatment is radiation therapy. In radiation therapy, a treatment planning system is made to specify the dose of X-rays needed to eradicate the tumor. To assure the right amount of X-ray dosage a quality assurance is using a phantom containing radiation sensors. LÄS MER
2. Indium Bump Fabrication using Electroplating for Flip Chip Bonding
Kandidat-uppsats, Mittuniversitetet/Avdelningen för elektronikkonstruktionSammanfattning : Hybrid pixel detectors are widely used in many fields, including military, environment, industry and medical treatment. When integrating such a detector, a vertical connection technique called flip-chip bonding is almost the only way to realize the high-density interconnection between each pixel detector to the read-out chip. LÄS MER
3. Flip-chip bonding by electroplated indium bump
Kandidat-uppsats, Mittuniversitetet/Avdelningen för elektronikkonstruktionSammanfattning : In hybrid pixel detector fabrication, high-density interconnection between focal plane array and the read-out integrated circuit is important. Bump bonding is the preferable assembly method, it is small in size, low cost, high performance and flexible I/O. LÄS MER
4. Thermo-mechanical Analysis of Bump Joints for Packages in Flip Chip Assemblies
Master-uppsats, Blekinge Tekniska Högskola/Institutionen för maskinteknikSammanfattning : .... LÄS MER