Sökning: "Gustaf Onsbring Gustafson"

Hittade 1 uppsats innehållade orden Gustaf Onsbring Gustafson.

  1. 1. Optimization of through-silicon via structures in a fingerprint sensor package

    Master-uppsats, Lunds universitet/Avdelningen för Biomedicinsk teknik

    Författare :Gustaf Onsbring Gustafson; [2017]
    Nyckelord :Through-silicon via; Fingerprint sensor; Semiconductor package; Technology and Engineering;

    Sammanfattning : The through-silicon via (TSV) is a type of vertical electrical connection that can pass through a silicon wafer or die. By using TSVs, compared to using wire bonding as interconnections in a capacitive fingerprint sensor, the capacitive strength between the sensor die and the finger can be increased. LÄS MER