Sökning: "Gustaf Onsbring Gustafson"
Hittade 1 uppsats innehållade orden Gustaf Onsbring Gustafson.
1. Optimization of through-silicon via structures in a fingerprint sensor package
Master-uppsats, Lunds universitet/Avdelningen för Biomedicinsk teknikSammanfattning : The through-silicon via (TSV) is a type of vertical electrical connection that can pass through a silicon wafer or die. By using TSVs, compared to using wire bonding as interconnections in a capacitive fingerprint sensor, the capacitive strength between the sensor die and the finger can be increased. LÄS MER
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