Sökning: "Through-silicon via"

Hittade 2 uppsatser innehållade orden Through-silicon via.

1. 1. Optimization of through-silicon via structures in a fingerprint sensor package

   Master-uppsats, Lunds universitet/Avdelningen för Biomedicinsk teknik

   Författare :Gustaf Onsbring Gustafson; [2017]
   Nyckelord :Through-silicon via; Fingerprint sensor; Semiconductor package; Technology and Engineering;

   Sammanfattning : The through-silicon via (TSV) is a type of vertical electrical connection that can pass through a silicon wafer or die. By using TSVs, compared to using wire bonding as interconnections in a capacitive fingerprint sensor, the capacitive strength between the sensor die and the finger can be increased. LÄS MER

3. 2. Development of Through Glass Vias (TGVs) for Interposer Applications

   Master-uppsats, KTH/Mikro- och nanosystemteknik

   Författare :Vlad Cornean; [2014]
   Nyckelord :;

   Sammanfattning : In this thesis work the manufacturing of through glass vias (TGVs) is presented. The TGVs were manufactured by adapting technique based on magnetic assembly developed at KTH for creating through silicon vias (TSVs). LÄS MER