Sökning: "wire bonding"

Visar resultat 1 - 5 av 6 uppsatser innehållade orden wire bonding.

  1. 1. Single Sided Bonding of Cylindrical Battery Cells

    Master-uppsats, KTH/Industriell produktion

    Författare :Xu He; [2021]
    Nyckelord :cylindrical battery cell; single side bonding; ultrasonic wire bonding; cylindrisk battericell; enkelsidig bindning; ultraljudstrådsbindning;

    Sammanfattning : Over the last ten years the Li-ion battery cells plays a significant role in the world’s decarbonization and reduction of CO2 emission. They are widely applied in many industries, such as consumer electronics, transportation and energy storage industries. LÄS MER

  3. 2. Finite element modelling of strained nanowire heterostructures

    Kandidat-uppsats, Lunds universitet/Synkrotronljusfysik; Lunds universitet/Fysiska institutionen

    Författare :Alexander Grape Wyke; [2019]
    Nyckelord :Strain; nanowire; heterostructure; physics; nanophysics; COMSOL; simulation; lattice; Physics and Astronomy;

    Sammanfattning : When two materials with different lattice constants are grown together, this generates stress between them, and therefore strain. This strain causes them to have different thermal and electrical properties, and this is especially important on the nanoscale where changes have large impacts. LÄS MER

  4. 3. Inductive Coupling Emissions between Bond Wires in Integrated Circuits

    Kandidat-uppsats, Lunds universitet/Institutionen för elektro- och informationsteknik

    Författare :Erman Nurdal; Gabriel Beldin; [2019]
    Nyckelord :Interference; Coupling; Induction; Bond Wire; Integrated Circuit; Technology and Engineering;

    Sammanfattning : When making an Integrated Chip, there is a process called contacting or bonding. In this process, the circuit is connected to the capsule. As a result, there is interference between the bond wires through inductive coupling. LÄS MER

  5. 4. Micro Assembly for Radio Frequency Electronics : Characterization of Bond Wires

    Master-uppsats, KTH/Skolan för elektroteknik och datavetenskap (EECS)

    Författare :Youjie Chen; [2019]
    Nyckelord :Bond wire interconnection; Radio frequency; Analytical model; Electromagnetic simulation; Electromagnetic measurement; Bindningstråd sammankoppling; Radiofrekvens; Analytisk modell; Elektromagnetisk simulering; Elektromagnetisk mätning;

    Sammanfattning : Due to the increasing number of components involved in Radio Frequency design, integration and packaging become an important topic of developing power-efficient and cost-effective solutions. Furthermore, interconnections are a key factor in such a topic because they are heavily used in Radio Frequency engineering, especially in the Fifth Generation. LÄS MER

  7. 5. Optimization of through-silicon via structures in a fingerprint sensor package

    Master-uppsats, Lunds universitet/Avdelningen för Biomedicinsk teknik

    Författare :Gustaf Onsbring Gustafson; [2017]
    Nyckelord :Through-silicon via; Fingerprint sensor; Semiconductor package; Technology and Engineering;

    Sammanfattning : The through-silicon via (TSV) is a type of vertical electrical connection that can pass through a silicon wafer or die. By using TSVs, compared to using wire bonding as interconnections in a capacitive fingerprint sensor, the capacitive strength between the sensor die and the finger can be increased. LÄS MER