MODULÄR TESTUPPSTÄLLNING : Modularisering i elektriska system mellan olika I/O gränssnitt

Sammanfattning: In the current development work conducted at BAE Systems Hägglunds AB's electronics department, there are often long lead times from started projects to finished electronic units. This means that it is necessary to take a new approach to development in order to meet changing specifications and new interfaces. To mitigate the risks in design and interfaces, testing of the system needs to start as early as possible. Against the given background, the aim of the project is to develop and evaluate a modular concept for different Input/output (I/O) interfaces between a carrier board and modules. The modular concept where developed using Altium Designer and through schematic design and PCB design the designs was developed for the intended concept regarding modularization. To test the connections between the carrier board and modules and to get a visual picture over how it could look, Altium designers Multi-board Assembly function where used. By analyzing the boundaries between the carrier board and I/O-modules, new limitations were discovered in the contact surfaces between them. The focus turned to improve the existing carrier board by replacing the existing connectors with more modular alternative connectors that better fits the intended concept of the modularity in the I/O-modules. Three different alternatives for the current carrier board were evaluated and the alternative that is the best for modularization is to change the connectors on the current carrier board. The design of the I/O-modules are based on the already existing I/O designs and the I/O-modules designed were Digital Input (DIP) and Digital Output (DOP). The results that emerged during the project are as follows: The designed I/O-modules follow a relationship-based design to produce a combination of the different circuit solution already available at BAE Systems. The circuits DIP and DOP are the most common I/O-interfaces in use and the focus was to develop modules for these. In order to achieve the optimal modularity with respect for the intended concept, the current design of the carrier boards need to change to meet the intended concept regarding modularization.