Visualization, modeling and consequences of residual stresses in glass frit sealing of a UV light source

Sammanfattning: PureFize Technologies AB develops and manufactures a broadband ultraviolet (UVC) light technology device that is mercury-free and based on nanotechnology, using the principle of field emission. The light source is made of Ti and glass, which are hermetically bonded, using a low-temperature glass frit, at elevated temperatures. The bonding procedure will induce stresses in the device originating from the mismatch of the coefficient of thermal expansion (CTE) between the materials. Brittle materials, as glass, withstands tensile stresses poorly. Therefore, the stress magnitude and distribution needs to be understood.  This work develops a quality inspection method for the glass bond and internal stresses, as well as stress simulations of the device, to be used in production at the company. The glass bond width and the internal stresses in the device were classified and analyzed by light optical microscopy and by polarised light optical microscopy. The optical analysis was followed by pressure tests of the devices using a chamber that allowed for pressurized air up to 7 bar. In parallell with the experimental work, stress and deformation simulations of the device using the finite element method (FEM) was made. Data collected from the inspections and pressure tests were compiled and analyzed, showing clear connections between the glass bond quality and the device's ability to withstand external pressure. A narrow glass bond could withstand external pressure poorly, whereas a wide glass bond could withstand external pressure well. Correlations could be made both between the glass bond appearance and the stress patterns, as well as between the FEM simulations and the stress patterns in the device. It is clear that the stresses induced in the device after bonding originates from the CTE mismatch of the bonded components when cooling it from the bonding temperature to room temperature. The pressure testing method proved to be an efficient way of verifying the maximum pressure capacity of the devices.  The knowledge from this thesis can be used when further investigating induced stresses from glas frit bonding.