Sökning: "Solder paste laments"
Hittade 1 uppsats innehållade orden Solder paste laments.
1. An analytical and numerical study of droplet formation and break-off for jetting of dense suspensions
Master-uppsats, KTH/MekanikSammanfattning : The jet printing of solder paste from a uid dynamics perspective involves viscosity change due to varying shear rate and eventual break o of the ejected solder paste droplet from the uid in the printer head. The ability to model the jetting process in a simulation package is important as it can be used as a tool for future development of the jetting device. LÄS MER
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